crashbandicootcrashbandicoot| Shennan Circuit: FC-BGA package substrates with 14 layers and below can be mass produced, and glass substrates are not produced
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[Shennan Circuit already has the production capacity of FC-BGA packaging substrates with 14 layers and below]
In the institutional survey on May 21,crashbandicootcrashbandicoot, Shennan Circuit disclosedcrashbandicootcrashbandicootThe production status of its FC-BGA packaging substrate products was introduced. The company already has the ability to batch produce products with 14 floors and below. At the same time, in the field of products with 14 floors and above, the company has the technology to manufacture samples.
In addition, Shennan Circuit showed strong interest in glass substrate technology and conducted in-depth research. However, the company is currently not involved in the production of glass substrates, and this decision may be affected by differences in material characteristics and production processes. The uniqueness of different materials in application fields is also within the company's consideration.
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